RF5603 Datasheet, PDF (6/24 Pages) RF Micro Devices – 3.0V TO 5.0V, 3.3GHz TO 3.8GHz LINEAR POWER AMPLIFIER

RF5603
PCB Metal Land and Solder Mask Pattern
Note: If it is desired to build the same PCB to accommodate the RF5602 as well as the RF5623/RF5603 use the following PCB
Patterns.
Note: Thermal vias for center slug “C” should be incorporated into the PCB design. The number and size of thermal vias will
depend on the application. Example of the number and size of vias can be found on the RFMD evaluation board layout.
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