SBB5000 Datasheet, PDF (5/6 Pages) RF Micro Devices – 0.05GHz to 6GHz, CASCADABLE ACTIVE BIAS InGaP HBT MMIC AMPLIFIER

SBB5000
Pin Function Description
RF IN
This pad is DC coupled and matched to 50. An external DC block is required.
RF OUT
This pad is DC coupled and matched to 50. DC bias is applied through this pad.
DIE
Die backside must be connected to RF/DC ground using silver filled conductive epoxy.
Notes:
BACKSIDE
1. All dimensions in inches [millimeters].
2. Die thickness is 0.004 [0.100].
3. Typical bond pad is 0.003x0.006
4. Backside metallization: Gold.
5. Bond pad metallization: Gold.
6. Backside is ground.
Die Dimensions
DS111219
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
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