SBB3000 Datasheet, PDF (5/5 Pages) RF Micro Devices – 50MHz to 6000MHz InGaP HBT ACTIVE BIAS GAIN BLOCK

SBB3000
Pin Names and Descriptions
Pin
Name Description
RF IN
RF input. An external DC blocking capacitor chosen for the frequency of operation is required.
DIE
Die backside must be connected to RF/DC ground using silver filled conductive epoxy.
BACKSIDE
RF OUT/
DC BIAS
RF output and DC bias input. An external DC blocking capacitor chosen for the frequency of operation is
required.
Die Dimensions
0.021”
[0.52]
0.023”
[0.59]
RF IN
Notes:
1. All dimensions in inches [millimeters]
2. Die thickness: 0.004 [0.10]
3. Typical bond pad size is 0.003 x 0.007
4. Backside metallization: Gold
5. Bond pad metallization: Gold
6. Backside is ground
RF OUT
DC Bias In
Part Number
SBB3000
SBB3000S2
Ordering Information
Description
Container
Bare Die
Gel Pack
Bare Die
Gel Pack
Quantity
10
2
DS120719
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at ([phone] or [e-mail].
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