SBB-4000 Datasheet, PDF (5/6 Pages) RF Micro Devices – 0.05GHZ TO 6GHZ, CASCADABLE ACTIVE BIAS InGaP HBT MMIC AMPLIFIER

Preliminary
SBB-4000
Pin Function Description
RF IN
This pad is DC coupled and matched to 50Ω. An external DC block is required.
RF OUT
This pad is DC coupled and matched to 50Ω. DC bias is applied through this pad.
DIE
Die backside must be connected to RF/DC ground using silver filled conductive epoxy.
Notes:
BACKSIDE
1. All dimensions in inches [millimeters].
2. Die thickness is 0.004 [0.100].
3. Typical bond pad is 0.003x0.006
4. Backside metallization: Gold.
5. Bond pad metallization: Gold.
6. Backside is ground.
Die Dimensions
EDS-106101 Rev A
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