RFPA5552 Datasheet, PDF (5/7 Pages) RF Micro Devices – Wi-Fi Integrated PA Module

RFMD + TriQuint = Qorvo
Pin Out
RFPA5552
Wi-Fi Front End Module
4900MHz to 5925MHz
NC
GND
RFIN
GND
PA_EN
VCC1 VCC2 VCC3 GND GND
20 19 18 17 16
6
7
8
9
10
NC NC NC NC PDET
GND
GND
RFOUT
GND
GND
Pin Names and Descriptions
PIN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Pkg Base
NAME
NC
GND
RFIN
GND
PAEN
NC
NC
NC
NC
PDET
GND
GND
RFOUT
GND
GND
GND
GND
VCC3
VCC2
VCC1
GND
DESCRIPTION
Not connected internally. It may be left floating or connected to ground.
Ground connection. Not connected internally and can be left floating or connected to ground.
RF input, internally matched to 50Ω and DC shorted. External DC blocking capacitor required.
Ground connection. Not connected internally and can be left floating or connected to ground.
Input enable bias voltage (regulated internally).
Not connected internally. It may be left floating or connected to ground.
Not connected internally. It may be left floating or connected to ground.
Not connected internally. It may be left floating or connected to ground.
Not connected internally. It may be left floating or connected to ground.
Power detector. Provides an output voltage proportional to the RF output power level.
Ground connection. Not connected internally and can be left floating or connected to ground.
Ground connection. Not connected internally and can be left floating or connected to ground.
RF output, internally matched to 50Ω and DC shorted. External DC blocking capacitor
required.
Ground connection. Not connected internally and can be left floating or connected to ground.
Ground connection. Not connected internally and can be left floating or connected to ground.
Ground connection. Not connected internally and can be left floating or connected to ground.
Ground connection. Not connected internally and can be left floating or connected to ground.
Third stage supply voltage
Second stage supply voltage.
First stage supply voltage.
Ground connection. The back side of the package should be connected to the ground plan
though as short of a connection as possible. PCB vias under the device are recommended.
Package Outline (Dimensions in millimeters)
Revision DS20160219
© 2016 RF Micro Devices, Inc.
5 of 7
Disclaimer: Subject to change without notice
www.rfmd.com / www.qorvo.com