RF6100-4_1 Datasheet, PDF (4/8 Pages) RF Micro Devices – 3V 1900MHZ LINEAR POWER AMPLIFIER MODULE

RF6100-4
Pin
1
2
3
4
5
6
7
8
9
10
Pkg
Base
Function
VCC1
RF IN
GND
VMODE
VREG
GND
GND
RF OUT
GND
VCC2
GND
Description
First stage collector supply. A low frequency decoupling capacitor
(e.g., 4.7μF) may be required.
RF input internally matched to 50Ω. This input is internally AC-coupled.
Ground connection. Connect to package base ground. For best perfor-
mance, keep traces physically short and connect immediately to ground
plane.
For nominal operation (High Power Mode), V_MODE is set LOW. When set
HIGH, devices are biased lower to improve efficiency.
Regulated voltage supply for amplifier bias. In Power Down mode, both
V_REG and V_MODE need to be LOW (<0.5V).
Ground connection. Connect to package base ground. For best perfor-
mance, keep traces physically short and connect immediately to ground
plane.
Ground connection. Connect to package base ground. For best perfor-
mance, keep traces physically short and connect immediately to ground
plane.
RF Output internally matched to 50Ω. This output is internally
AC-coupled.
Ground connection. Connect to package base ground. For best perfor-
mance, keep traces physically short and connect immediately to ground
plane.
Output stage collector supply. A low frequency decoupling capacitor (e.g.,
4.7μF) is required.
Ground connection. The backside of the package should be soldered to a
top side ground pad which is connected to the ground plane with multiple
vias. The pad should have a short thermal path to the ground plane.
Interface Schematic
Package Drawing
1.40
1
1.25
4.00
± 0.10
4.00
± 0.10
Dimensions in mm.
Shaded areas represent pin 1
location.
0.450
± 0.075
3.903 TYP
3.453 TYP
3.053
2.653
2.205 TYP
1.8051.T4Y7P5
1.T4Y5P5
00..110535
0.T0Y0P0
1
3.850
3.050
2.825
2.600
2.418
2.053
1.953
1.353
0.953
0.553
0.155
4 of 8
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Rev A1 DS050929