RF6100-1_1 Datasheet, PDF (4/8 Pages) RF Micro Devices – 3V 900MHZ LINEAR POWER AMPLIFIER MODULE

RF6100-1
Pin
1
2
3
4
5
6
7
8
9
10
Pkg
Base
Function
VREG
VMODE
GND
RF IN
VCC1
VCC2
GND
RF OUT
GND
GND
GND
Description
Regulated voltage supply for amplifier bias. In Power Down mode, both
V_REG and V_MODE need to be LOW (<0.5V).
For nominal operation (High Power Mode), V_MODE is set LOW. When set
HIGH, devices are biased lower to improve efficiency.
Ground connection. Connect to package base ground. For best perfor-
mance, keep traces physically short and connect immediately to ground
plane.
RF input internally matched to 50Ω. This input is internally AC-coupled.
First stage collector supply. A low frequency decoupling capacitor
(e.g., 4.7μF) may be required.
Output stage collector supply. A low frequency decoupling capacitor (e.g.,
4.7μF) is required.
Ground connection. Connect to package base ground. For best perfor-
mance, keep traces physically short and connect immediately to ground
plane.
RF output internally matched to 50Ω. This output is internally
AC-coupled.
Ground connection. Connect to package base ground. For best perfor-
mance, keep traces physically short and connect immediately to ground
plane.
Ground connection. Connect to package base ground. For best perfor-
mance, keep traces physically short and connect immediately to ground
plane.
Ground connection. The backside of the package should be soldered to a
top side ground pad which is connected to the ground plane with multiple
vias. The pad should have a short thermal path to the ground plane.
Interface Schematic
Package Drawing
4.00
1
± 0.10
1.40
1.25
4.00
± 0.10
0.450
± 0.075
3.900 TYP
2.425
2.200
1.800
1.525
1.350
0.950
0.500 TYP
0.100 TYP
0.000
R0.20 TYP
1
3.549
3.500
3.050
2.650
2.400
TYP
2.200
1.800
1.650
1.350
0.950
0.725
0.125
4 of 8
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Rev A1 DS050929