RF6100-1_06 Datasheet, PDF (4/6 Pages) RF Micro Devices – 3V 900MHZ LINEAR POWER AMPLIFIER MODULE

RF6100-1
Pin
1
2
3
4
5
6
7
8
9
10
Pkg
Base
Function
VREG
VMODE
GND
RF IN
VCC1
VCC2
GND
RF OUT
GND
GND
GND
Description
Interface Schematic
Regulated voltage supply for amplifier bias. In Power Down mode, both
V_REG and V_MODE need to be LOW (<0.5V).
For nominal operation (High Power Mode), V_MODE is set LOW. When
set HIGH, devices are biased lower to improve efficiency.
Ground connection. Connect to package base ground. For best perfor-
mance, keep traces physically short and connect immediately to
ground plane.
RF input internally matched to 50Ω. This input is internally AC-coupled.
First stage collector supply. A low frequency decoupling capacitor
(e.g., 4.7μF) may be required.
Output stage collector supply. A low frequency decoupling capacitor
(e.g., 4.7μF) is required.
Ground connection. Connect to package base ground. For best perfor-
mance, keep traces physically short and connect immediately to
ground plane.
RF output internally matched to 50Ω. This output is internally
AC-coupled.
Ground connection. Connect to package base ground. For best perfor-
mance, keep traces physically short and connect immediately to
ground plane.
Ground connection. Connect to package base ground. For best perfor-
mance, keep traces physically short and connect immediately to
ground plane.
Ground connection. The backside of the package should be soldered to
a top side ground pad which is connected to the ground plane with mul-
tiple vias. The pad should have a short thermal path to the ground
plane.
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Rev A1 050929