RF5110G_15 Datasheet, PDF (18/24 Pages) RF Micro Devices – GENERAL PURPOSE / GSM POWER AMPLIFIER

RF5110G
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3inch
to 8inch gold over 180inch nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested
for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly pro-
cesses. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
A = 0.64 x 0.28 (mm) Typ.
B = 0.28 x 0.64 (mm) Typ.
C = 1.50 (mm) Sq.
Dimensions in
mm.
1.50 Typ.
0.50 Typ.
Pin 16
Pin 1
A
0.50 Typ.
A
A
BBBB
C
Pin 12
A
A
0.75 Typ.
1.50
A
Typ.
A
0.55 Typ.
0.55 Typ.
A
BBBB
Pin 8
0.75 Typ.
Figure 1. PCB Metal Land Pattern (Top View)
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7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or
technical support, contact RFMD / Qorvo at ([phone] or sales-
[e-mail].
DS20151202