RF6886_14 Datasheet, PDF (16/16 Pages) RF Micro Devices – AMPLIFIER

RF6886
Package Drawing
PCB Patterns
A = 0.260 x 0.528 (mm)
B = 0.528 x 0.260 (mm)
C = 2.700 x 2.700 (mm)
10x 0.240
A
A
A
A
A
A
6x 1.864
B
10x 0.240
B
12x 0.250
B
2x 1.250
B
2x 0.750
B
C
B
B
2x 0.250
0.000
B
2x 0.250
B
12x 0.250
B
B
2x 0.750
B
2x 1.250
A
A
A
A
A
A
6x 1.864
A = 0.400 x 0.668 (mm)
B = 0.668 x 0.400 (mm)
C = 2.840 x 2.840 (mm)
A = 0.234 x 0.475 (mm)
B = 0.475 x 0.234 (mm)
C = 1.125 x 1.125 (mm)
10x 0.100
10x 0.266
A
A
A
A
A
A
6x 1.864
A
A
A
A
A
A
6x 1.864
10x
0.100
B
B
B
B
12x 0.110
C
B
2x 1.250
B
10x 0.240
B
2x 0.750
B
12x 0.339
C
B
2x 0.250
0.000
B
2x 0.250
B
2x 0.325
B
2x 0.325
C
B
2x 1.250
B
2x 0.750
2x 0.725
B
2x 0.250
0.000
B
2x 0.250
B
12x 0.110
B
B
2x 0.750
B
C
12x 0.339
B
2x 1.250
B
C
B
2x 0.750
2x 0.725
B
2x 1.250
A
A
A
A
A
A
6x 1.864
A
A
A
A
A
A
6x 1.864
PCB METAL PATTERN
Thermal vias for center slug "C" should be incorporated into
the PCB design. The number and size of thermal vias will
depend on the application, the power dissipation, and the
electrical requirements. Example of the number and size of
vias can be found on the RFMD evaluation board layout.
Notes:
1. Shaded are represents Pin 1.
PCB SOLDER MASK PATTERN
PCB STENCIL PATTERN
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DS140303