RFPA2226 Datasheet, PDF (14/17 Pages) RF Micro Devices – 2.2GHz TO 2.7GHz 2W InGaP AMPLIFIER

RFPA2226
Evaluation Board Layout
(2.4GHz to 2.5GHz)
For V+=V_CC=V_PC=5.0V
Board Material GETEK, 10mil thick, Dk=3.9, 2oz. copper
PCB Notes: Do not use less than the recommended number of via holes under the device ground paddle. RF layers thicker
than .020 inches (0.5mm) not recommended.
Bill of Materials
(2.4GHz to 2.5GHz)
DESG
Q1
R1
R2
R3
R4
C1
C2
C3, 4
C5
C6
C7
C8
L1
Description
RFPA2226
1.02K, , 0603 1%
0, 0603
4.02K, , 0603 1%
47K, , 0603
1uF 16V MLCC CAP
5.6pF CAP, 0603
0.1uF CAP, 0603
2.0pF CAP, 0603
1.8pF CAP, 0603
1.5pF CAP, 0603
10pF CAP, 0603
12nH IND, 0805
Notes
DFN
0402 may be used
0402 may be used
0402 may be used
0402 may be used
Tantalum ok for EVM performance. Use MLCC type for best IM3 levels.
NPO ROHM MCH185A5R6DK or equiv.
X7R 0402 ok, ROHM MCH182CN104K or equiv.
NPO, low ESR ATC 600S2R0JW250 or equiv.
NPO, low ESR ATC 600S1R8CW250 or equiv.
NPO, low ESR ATC 600S1R5CW250 or equiv.
NPO, low EST ATC 600S100JW250 or equiv.
Coilcraft 0805HQ-12NXJBB.
14 of 17
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at ([phone] or [e-mail].
DS121010