RF5602 Datasheet, PDF (10/27 Pages) RF Micro Devices – 3.0V TO 5.0V, 2.3GHz TO 2.7GHz LINEAR POWER AMPLIFIER

RF5602
PCB Stencil Pattern
Note: Thermal vias for center slug “C” should be incoporated into the PCB design. The number and size of thermal vias will
depend on the application. Example of the number and size of vias can be found on the RFMD evaluation board layout.
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