RFPA5532 Datasheet, PDF (1/7 Pages) RF Micro Devices – Wi-Fi Integrated PA Module

RFMD + TriQuint = Qorvo
RFPA5532
Wi-Fi Integrated PA Module
4900MHz to 5925MHz
The RFPA5532 is a three-stage power amplifier (PA) designed for
802.11a/n/ac applications. The integrated input and output 50Ω match
greatly reduces the layout area, bill of materials and manufacturability
cost in the customer application. The PA is optimized to minimize the
required external components to maintain linear performance at 3.3V.
The RFPA5532 is manufactured on an advanced InGaP heterojunction
bipolar transistor (HBT) process and is capable of achieving linear powers
up to 21dBm with an EVM <1.8% while maintaining excellent power
added efficiency. The device is provided in a 4.0mm x 4.0mm x 0.90mm
package that meets or exceeds the power requirements of
IEEE802.11a/n/ac Wi-Fi RF systems.
VCC1 VCC2 VCC3 GND GND
RFPA5532
Package: QFN, 20-pin,
4.0mm x 4.0mm x 0.90mm
Features
■ POUT = 21dBm, 3.3V, 11ac, 80MHz
MCS9 at 1.8% EVM
■ POUT = 22dBm, 3.3V, 11n,
20/40MHz MCS7 at 3% EVM
■ Typical Gain = 32dB
■ High PAE
■ Required external components
minimized
■ Integrated Regulator
■ Input and Output Matched to 50Ω
■ Integrated Power Detector
NC 1
GND 2
RFIN 3
GND 4
PA_EN 5
REGULATOR
15 ^GND
14 ^GND
13 RFOUT
12 GND
11 GND
Applications
■ Customer Premise Equipment
(CPE)
■ Wireless Access Points, Gateways
■ Routers
■ Set-Top Box Applications
■ Picocell/Femtocell
NC NC NC NC PDET
Functional Block Diagram
Ordering Information
RFPA5532SB
Standard 5-piece Sample Bag
RFPA5532SQ
Standard 25-piece Sample Bag
RFPA5532SR
Standard 100-piece Reel
RFPA5532TR13
Standard 2500-piece Reel
RFPA5532PCK-410 Fully Assembled Evaluation Board plus 5 pieces
Revision DS20151222
© 2015 RF Micro Devices, Inc.
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Disclaimer: Subject to change without notice
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