HR9395-08A Datasheet, PDF (4/6 Pages) RFHIC – GaN Hybrid Power Amplifier

Preliminary
GaN Hybrid Power Amplifier HR9395-08A
Package Dimensions (Type: NP-18)
* Unit: mm[inch] | Tolerance: ±0.15[.006]
▲ Top View
▲ Side View
▲ Bottom View
Pin Description
Pin No Function Pin No Function Pin No Function Pin No Function
1
GND
3
GND
5
RF Output
7
Drain Bias (+V_DS)
2
RF Input
4
GND
6
GND
8
Gate Bias (-V_GS)
* Mounting Configuration Notes
1. For the proper performance of the device, Ground / Thermal via holes must be designed to remove heat.
2. To properly use heat sink, ensure the ground/thermal via hole region to contact the heat sink. We recommend the mounting screws be added near the
heat sink to mount the board.
3. In designing the necessary RF trace, width will depend upon the PCB material and construction.
4. Use 1 oz. Copper minimum thickness for the heat sink.
5. Do not put solder mask on the backside of the PCB in the region where the board contacts the heat sink.
6. We recommend adding as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
Korean Facilities : 82-31-8069-3036 / [e-mail]
US Facility : 919-677-8780 / [e-mail]
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All specifications may change without notice
Version 0.1