HR2933-50A Datasheet, PDF (3/5 Pages) RFHIC – GaN Hybrid Power Amplifier

Preliminary
GaN Hybrid Power Amplifier HR2933-50A
Package Dimensions (Type: NP-1E)
* Unit: mm[inch] | Tolerance: ±0.15[.006]
▲ Top View
▲ Side View
▲ Bottom View
Pin Description
Pin No Function Pin No Function Pin No Function Pin No Function
1
RF Input
4
Vgs1
8
GND
11
GND
2
GND
5
Vds1
9
GND
12
GND
3
GND
6
Vgs2
10 RF Output 13
GND
-
-
7
Vds2
-
-
14
GND
Recommended Pattern
Recommended Pattern Detail ‘A’
Detail Pattern ‘A’
* Mounting Configuration Notes
1. For the proper performance of the device, Ground / Thermal via holes must be designed to remove heat.
2. To properly use heatsink, ensure the ground/thermal via hole region to contact the heatsink. We recommend the mounting screws
be added near the heatsink to mount the board
3. In designing the necessary RF trace, width will depend upon the PCB material and construction.
4. Use 1 oz. Copper minimum thickness for the heatsink.
5. Do not put solder mask on the backside of the PCB in the region where the board contacts the heatsink
6. We recommend adding as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
Korean Facilities : 82-31-8069-3036 / [e-mail]
US Facilities : 919-677-8780 / [e-mail]
3/5
All specifications may change without notice
Version 0.1