FSMD014-1812 Datasheet, PDF (2/2 Pages) RFE international – Surface Mount PPTC FSMD 1812 Series

Surface Mount PPTC
FSMD 1812 Series
THERMAL PRODUCT DIMENSIONS (MILLIMETERS)
Thermal Derating Curve, FSMD Series
200%
150%
100%
50%
0%
4- 0
2- 0
0
20
40
Ambient Temperature (C)
A
B
60
80
A= FSMD 075, 110, 110-16, 125, 150
160 & 200
B= FSMD 014, 020, 035 & 050
RoHS
ü
TYPICAL TIME-TO-TRIP AT 23°C
A B C D E FGH I J
100
10
1
0.1
0.01
0.001
0.1
1
10
Fault current (A)
A = FSMD014
B = FSMD020
C = FSMD035
D = FSMD050
E = FSMD075
F = FSMD110/110-16
G = FSMD125
H = FSMD150
I = FSMD160
100
J FSMD200
PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS
The dimensions in the table below provide the recommended pad layout for each FSMD 1812 device
NOMINAL PAD DIMENSIONS (MILLIMETERS)
3.5
260 °C
217 °C
f
200 °C
SOLDER RELOW
Ramp-up
3°C/Second Max
20 to 40 Seconds
Ramp-down
6°C/Second Max
150 °C
Preheat
1.78
1.78
3.45
25 °C
60 to 180 Seconds
60 to 150 Seconds
Solder Reflow
Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended.
1. Recommended reflow methods; IR, vapor phase oven, hot air oven.
2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only)
3. Recommended maximum paste thickness is 0.25mm.
4. Devices can be cleaned by using standard industry methods and solvents.
5. Storage Environment: <30°C / 60%RH
Caution:
If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.
Rework:
Use standard industry practices.
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C5ED04
REV 2007.8.14