PD16813_15 Datasheet, PDF (9/10 Pages) Renesas Technology Corp – MONOLITHIC DUAL H BRIDGE DRIVER CIRCUIT

µPD16813
RECOMMENDED SOLDERING CONDITIONS
It is recommended to solder this product under the conditions described below.
For soldering methods and conditions other than those listed below, consult NEC.
Surface mount type
For the details of the recommended soldering conditions of this type, refer to Semiconductor Device Mounting
Technology Manual (C10535E).
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Conditions
Symbol of Recommended
Soldering
Peak package temperature: 230 °C, Time: 30 seconds MAX. (210 °C MIN.),
Number of times: 1, Number of days: None^Note
IR30-00
Peak package temperature: 215 °C, Time: 40 seconds MAX. (200 °C MIN.),
Number of times: 1, Number of days: None^Note
VP15-00
Solder bath temperature: 260 °C MAX., Time: 10 seconds MAX.,
Number of times: 1, Number of days: None^Note
WS60-00
Pin temperature: 300 °C MAX., Time: 10 seconds MAX.,
–
Number of days: None^Note
Note The number of storage days at 25 °C, 65 % RH after the dry pack has been opened
Caution Do not use two or more soldering methods in combination (except partial heating).
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