NP60N04MUG_15 Datasheet, PDF (9/10 Pages) Renesas Technology Corp – SWITCHING N-CHANNEL POWER MOS FET

MARKING INFORMATION
NEC
60N04
UG
Pb-free plating marking
Abbreviation of part number
Lot code
NP60N04MUG
RECOMMENDED SOLDERING CONDITIONS
The NP60N04MUG should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method
Soldering Conditions
Wave soldering
Maximum temperature (Solder temperature): 260°C or below
MP-25K
Time: 10 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Partial heating
Maximum temperature (Pin temperature): 350°C or below
MP-25K
Time (per side of the device): 3 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Caution Do not use different soldering methods together (except for partial heating).
Recommended
Condition Symbol
THDWS
P350
Data Sheet D18663EJ2V0DS
7