PD17012GF-055_15 Datasheet, PDF (75/84 Pages) Renesas Technology Corp – SINGLE-CHIP MICROCONTROLLER WITH ON-CHIP PRESCALER, PLL FREQUENCY SYNTHESIZER, AND IF COUNTER FOR CAR-MOUNTED FM/MW/LW RADIO

µPD17012GF-055
11. RECOMMENDED SOLDERING CONDITIONS
Solder the package of this product under the conditions recommended as follows.
For details of the recommended conditions for soldering, please refer to the information document “Semiconductor
Device Mounting Technology Manual” (IEI-1207).
For soldering methods and conditions other than those recommended below, please contact NEC sales
personnel.
Table 11-1. Soldering Conditions for Surface-Mount Type
µPD17012GF-055-3BE: 64-pin plastic QFP (14 × 20 mm)
Soldering Method
Soldering Condition
Infrared reflow
VPS
Wave soldering
Pin part heating
Package peak temperature : 235 °C; time : within 30 secs (210 °C or more);
count: 2 max.; day limit : 7 days^Note (hereafter, pre-baked for 20 hrs at 125 °C)
<Caution>
(1) Start second reflow after device temperature (which has risen
because of first reflow) has returned to room temperature.
(2) Do not clean flux with water after first reflow.
Package peak temperature : 215 °C; time : within 40 secs (200 °C or more);
count: 2 max.; day limit : 7 days^Note (hereafter, pre-baked for 20 hrs at 125 °C)
<Caution>
(1) Start second reflow after device temperature (which has risen because of
first reflow) has returned to room temperature.
(2) Do not clean flux with water after first reflow.
Solder bath temperature: no more than 260 °C; time : within 10 secs; count:
once; preheating temperature : 120 °C max. (package surface temperature);
day limit : 7 days^Note (hereafter, pre-baked for 20 hours at 125 °C)
Pin temperature : no more than 300 °C; time : within 3 secs (per device side)
Recommended
Condition Symbol
IR35-207-2
VP15-207-2
WS60-207-1
—
Note Refers to the number of days for storage after the dry pack is opened. The storage conditions are 25 °C
and no more than 65 % RH.
Caution Avoid using multiple soldering methods at the same time (except the pin part heating method).
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