PD8670_15 Datasheet, PDF (26/30 Pages) Renesas Technology Corp – 7400 PIXELS CCD LINEAR IMAGE SENSOR

µ PD8670
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to
consult with our sales offices.
Type of Through-hole Device
µ PD8670CY : CCD linear image sensor 32-pin plastic DIP (10.16 mm (400))
Process
Conditions
Partial heating method
Pin temperature : 350°C or below, Heat time : 3 seconds or less (per pin)
Cautions 1. During assembly care should be taken to prevent solder or flux from contacting the plastic cap.
The optical characteristics could be degraded by such contact.
2. Soldering by the solder flow method may have deleterious effects on prevention of plastic cap
soiling and heat resistance. So the method cannot be guaranteed.
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Data Sheet S16749EJ1V0DS