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RJK0210DPA Datasheet, PDF (2/4 Pages) Renesas Technology Corp – Silicon N Channel Power MOS FET Power Switching
RJK0210DPA
Electrical Characteristics
Item
Symbol Min
Drain to source breakdown voltage V(BR)DSS
25
Gate to source leak current
IGSS
—
Zero gate voltage drain current
IDSS
—
Gate to source cutoff voltage
VGS(off)
1.2
Static drain to source on state
RDS(on)
—
resistance
RDS(on)
—
Forward transfer admittance
|yfs|
—
Input capacitance
Ciss
—
Output capacitance
Coss
—
Reverse transfer capacitance
Crss
—
Gate Resistance
Rg
—
Total gate charge
Qg
—
Gate to source charge
Qgs
—
Gate to drain charge
Qgd
—
Turn-on delay time
td(on)
—
Rise time
tr
—
Turn-off delay time
td(off)
—
Fall time
tf
—
Body–drain diode forward voltage
VDF
—
Body–drain diode reverse recovery
trr
—
time
Notes: 4. Pulse test
Typ
—
—
—
—
4.5
5.7
75
2290
750
25
0.9
11.8
6.2
1.2
TBD
TBD
TBD
TBD
0.82
TBD
Max
—
±0.1
1
2.5
5.4
7.4
—
3200
—
—
1.9
—
—
—
—
—
—
—
1.07
—
Preliminary
Unit
V
A
A
V
m
m
S
pF
pF
pF

nC
nC
nC
ns
ns
ns
ns
V
ns
(Ta = 25°C)
Test Conditions
ID = 10 mA, VGS = 0
VGS = +16, –12 V, VDS = 0
VDS = 20 V, VGS = 0
VDS = 10 V, I D = 1 mA
ID = 20 A, VGS = 10 V Note4
ID = 20 A, VGS = 4.5 V Note4
ID = 20 A, VDS = 5 V Note4
VDS = 10 V
VGS = 0
f = 1 MHz
VDD = 10 V
VGS = 4.5 V
ID = 40 A
VGS = 10 V, ID = 20 A
VDD  10 V
RL = 0.5 
Rg = 4.7 
IF = 40 A, VGS = 0 Note4
IF =40 A, VGS = 0
diF/ dt = 100 A/ s
REJ03G1948-0021 Rev.0.21
Jul 02, 2010
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