UPC2905BT-AZ Datasheet, PDF (17/19 Pages) Renesas Technology Corp – Old Company Name in Catalogs and Other Documents

μ PC29xxB Series
<R> RECOMMENDED MOUNTING CONDITIONS
The μ PC29xxB Series should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Surface Mount Device
μ PC29xxBT Series: SC-63 (MP-3Z)
μ PC29xxBT1D Series: TO-252 (MP-3ZK)
Process
Conditions
Infrared Ray Reflow
Peak temperature: 260°C or below (Package surface temperature),
Reflow time: 60 seconds or less (at 220°C or higher),
Maximum number of reflow processes: 3 times or less.
Vapor Phase Soldering
Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 3 times or less.
Partial Heating Method
Pin temperature: 350°C or below,
Heat time: 3 seconds or less (Per each side of the device).
μ PC29xxBT-AZ Series ^Note1, μ PC29xxBT-AY Series ^Note2: SC-63 (MP-3Z)
μ PC29xxBT1D-AT Series ^Note3: TO-252 (MP-3ZK)
Process
Conditions
Infrared Ray Reflow
Peak temperature: 260°C or below (package surface temperature),
Reflow time: 60 seconds or less (at 220°C or higher),
Maximum number of reflows processes: 3 times or less.
Partial Heating Method
Pin temperature: 350°C or below,
Heat time: 3 seconds or less (per each side of the device).
Notes 1. Pb-free (This product does not contain Pb in the external electrode.)
2. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.)
3. Pb-free (This product does not contain Pb in the external electrode and other parts.)
Symbol
IR60-00-3
VP15-00-3
P350
Symbol
IR60-00-3
P350
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device
will be damaged by heat stress.
Remark Flux: Rosin-based flux with low chlorine content (chlorine 0.2 Wt% or below) is recommended.
Data Sheet G17567EJ4V0DS
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