PS9308L_15 Datasheet, PDF (17/22 Pages) Renesas Technology Corp – 2.0 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 6-PIN SDIP PHOTOCOUPLER

PS9308L, PS9308L2
Chapter Title
NOTES ON HANDLING (UNIT: mm)
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of peak reflow temperature
• Time of temperature higher than 220°C
• Time to preheat temperature from 120 to 180°C
• Number of reflows
• Flux
260°C or below (package surface temperature)
10 seconds or less
60 seconds or less
120 ± 30 s
Three
Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt% is
recommended.)
Recommended Temperature Profile of Infrared Reflow
180°C
120°C
120±30 s
(preheating)
(heating)
to 10 s
to 60 s
260°C MAX.
220°C
Time (s)
(2) Wave soldering
• Temperature
• Time
• Preheating conditions
• Number of times
• Flux
260°C or below (molten solder temperature)
10 seconds or less
120°C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
R08DS0048EJ0200 Rev.2.00
Sep 27, 2013
Page 17 of 20