PD16814_15 Datasheet, PDF (12/14 Pages) Renesas Technology Corp – MONOLITHIC DUAL H BRIDGE DRIVER CIRCUIT

µPD16814
RECOMMENDED SOLDERING CONDITIONS
It is recommended to solder this product under the conditions shown below.
For soldering methods and conditions other than those listed below, consult NEC.
For details of the recommended soldering conditions, refer to Information Document “Semiconductor Device
Mounting Technology Manual” (C10535E).
Surface Mount Type
Soldering Method
Soldering Condition
Symbol of Recommended
Soldering
Infrared reflow
Package peak temperature: 235 °C, Time: 30 seconds MAX. (210 °C MIN.)
Number of times: 2 MAX.
<Precautions>
(1) Start the second reflow after the device temperature rise due to the first
reflow has dropped to room temperature.
(2) Do not clean flux with water after the first reflow.
IR35-00-2
VPS
Package peak temperature: 215 °C, Time: 40 seconds MAX. (200 °C MIN.)
Number of times: 2 MAX.
<Precautions>
(1) Start the second reflow after the device temperature rise due to the first
reflow has dropped to room temperature.
(2) Do not clean flux with water after the first reflow.
VP15-00-2
Wave soldering
Soldering bath temperature: 260 °C MAX., Time: 10 seconds MAX.,
Number of times: 1
Preheating temperature: 120 °C MAX. (package surface temperature)
WS60-00-1
Partial heating Pin temperature: 300 °C MAX., Time: 3 seconds MAX. (per side of device)
–
Caution Do not use two or more soldering methods in combination (except partial heating).
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