R8C22 Datasheet, PDF (1/52 Pages) Renesas Technology Corp – MCU

R8C/22 Group, R8C/23 Group
RENESAS MCU
REJ03B0097-0110
Rev.1.10
Mar 16, 2007
1. Overview
This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is
packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level
of instruction efficiency. With 1 Mbyte of address space, it is capable of executing instructions at high speed. This
MCU is equipped with one CAN module and suited to in-vehicle or FA networking.
Furthermore, the data flash (1 KB x 2 blocks) is embedded in the R8C/23 Group.
The difference between R8C/22 and R8C/23 Groups is only the existence of the data flash. Their peripheral functions
are the same.
1.1 Applications
Automotive, etc.
Rev.1.10 Mar 16, 2007 Page 1 of 48
REJ03B0097-0110