R5F213G2MNNP Datasheet, PDF (1/56 Pages) Renesas Technology Corp – RENESAS MCU

Datasheet
R8C/3GM Group
RENESAS MCU
R01DS0127EJ0100
Rev.1.00
Jul 27, 2011
1. Overview
1.1 Features
The R8C/3GM Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are
designed to maximize EMI/EMS performance.
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of
system components.
The R8C/3GM Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.
1.1.1 Applications
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.
R01DS0127EJ0100 Rev.1.00
Jul 27, 2011
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