HMC515 Datasheet, PDF (7/9 Pages) –

Outline Drawing
HMC515LP5 / 515LP5E
v03.0811
MMIC VCO w/ HALF FREQUENCY OUTPUT
& DIVIDE-BY-4, 11.5 - 12.5 GHz
Package Information
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
Part Number
HMC515LP5
Package Body Material
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC515LP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL3 ^[1]
MSL3 ^[2]
Package Marking ^[3]
H515
XXXX
H515
XXXX
Pin Descriptions
Pin Number
Function
1 - 3, 7 - 10, 13 - 18,
20, 22 - 28, 30 - 32
N/C
Description
No Connection. These pins may be connected to RF/
DC ground. Performance will not be affected.
Interface Schematic
4
RFOUT/4
Divide-by-4 Output.
8
Supply Voltage for prescaler. If prescaler is not
6
Vcc1
required, this pin may be left open to conserve
65 mA of current.
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: [phone] Fax: [phone] Order On-line at www.hittite.com
Application Support: Phone: [phone] or [e-mail]
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