QT1081 Datasheet, PDF (16/20 Pages) Quantum Research Group – 8-KEY QTOUCH SENSOR IC

4.8 Mechanical - 32-QFN Package
PIN 1
0.43mm
Exposed
Centre
Pad
Corner tie
bar
Dimensions In Millimeters
Symbol Minimum Nominal Maximum
A
0.70
-
0.95
A1
0.00
0.02
0.05
b
0.18
0.25
0.32
C
-
0.20 REF
-
D
4.90
5.00
5.10
D2
3.05
-
3.65
E
4.90
5.00
5.10
E2
3.05
-
3.65
e
-
0.50
-
L
0.30
0.40
0.50
y
0.00
-
0.075
L1
0.00
-
0.10
Depending upon the IC assembly supplier, the package may
be slightly different from that depicted above. See the
magnified areas for the main difference between the ICs.
Dimension L1 represents terminal pull-back from the package
edge. Where terminal pull-back exists, only the upper half of
the lead is visible on the package edge due to half etching of
the leadframe.
The corner tie bar is connected internally to the exposed
central pad.
Note that there is no functional requirement for the large pad on the underside of this package to be
soldered. If the final application requires this area to be soldered for mechanical reasons, the pad to
which it is soldered must be isolated and contained under the footprint only.
lQ
16
QT1081_1R0.04_0307