QRD1113 Datasheet, PDF (1/3 Pages) QT Optoelectronics – REFLECTIVE OBJECT SENSOR

QRD1113/1114
REFLECTIVE OBJECT SENSOR
PACKAGE DIMENSIONS
0.083 (2.11)
OPTICAL
CENTERLINE
PIN 1 INDICATOR
0.120 (3.05)
0.240 (6.10)
0.173 (4.39)
FEATURES
• Phototransistor Output
• No contact surface sensing
• Unfocused for sensing diffused surfaces
• Compact Package
• Daylight filter on sensor
0.183 (4.65)
0.500 (12.7)
MIN
0.020 (0.51)
SQ. (4X)
2
1
0.083 (2.11)
3
0.100 (2.54)
4
NOTES (Applies to Max Ratings and Characteristics Tables.)
1. Derate power dissipation linearly 1.33 mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning
agents.
4. Soldering iron 1/16” (1.6mm) from housing.
5. As long as leads are not under any spring tension.
6. D is the distance from the sensor face to the reflective surface.
7. Cross talk (I_CX) is the collector current measured with the
indicator current on the input diode and with no reflective surface.
8. Measured using an Eastman Kodak neutral white test card with
90% diffused reflecting as a reflective surface.
NOTES:
PIN 1 COLLECTOR
PIN 2 EMITTER
PIN 3 ANODE
PIN 4 CATHODE
1. Dimensions for all drawings are in inches (millimeters).
2. Tolerance of ± .010 (.25) on all non-nominal dimensions
unless otherwise specified.
3. Pins 2 and 4 typically .050” shorter than pins 1 and 3.
4. Dimensions controlled at housing surface.
SCHEMATIC
2
3
1
4
ABSOLUTE MAXIMUM RATINGS (T_A = 25°C unless otherwise specified)
Parameter
Symbol
Rating
Operating Temperature
Storage Temperature
Lead Temperature (Solder Iron)^(2,3)
Lead Temperature (Solder Flow)^(2,3)
EMITTER
Continuous Forward Current
Reverse Voltage
Power Dissipation⁽¹⁾
SENSOR
Collector-Emitter Voltage
Emitter-Collector Voltage
Power Dissipation⁽¹⁾
1 of 3
T_OPR
T_STG
T_SOL-I
T_SOL-F
I_F
V_R
P_D
V_CEO
V_ECO
P_D
-40 to +85
-40 to +85
240 for 5 sec
260 for 10 sec
50
5
100
30
100
Units
°C
°C
°C
°C
mA
V
mW
V
V
mW
100030A