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ASM3P2811A_1 Datasheet, PDF (4/11 Pages) PulseCore Semiconductor – Low Power EMI Reduction IC
April 2008
rev 1.6
Operating Conditions
Symbol
VDD
TA
CL
CIN
Parameter
Voltage on any pin with respect to GND
Operating temperature
Load Capacitance
Input Capacitance
DC Electrical Characteristics
Symbol
Parameter
VIL
Input low voltage
VIH
Input high voltage
IIL
Input low current
(Inputs D_C, SRS and FRS are pulled high internally)
IIH
Input high current
IXOL
XOUT Output low current
(VXOL@ 0.4V, VDD = 3.3V)
IXOH
XOUT Output high current
(VXOH@ 2.5V, VDD = 3.3V)
VOL
Output low voltage (VDD = 3.3V, IOL = 5mA)
VOH Output high voltage (VDD = 3.3V, IOH = -5mA)
ICC
IDD
VDD
Dynamic supply current (Unloaded Output)
Static supply current , Standby mode
(CLKIN pulled to GND)
Operating voltage
tON
ZOUT
Power up time (first locked clock cycle after power up)
Clock out impedance
AC Electrical Characteristics
Symbol
Parameter
fIN
Input frequency for ASM3P2811/12/13/14 A/B
Output frequency for ASM3P2811A/B
fOUT Output frequency for ASM3P2812A/B
Output frequency for ASM3P2814A/B
tLH* Output rise time (measured at 0.8V to 2.0V)
tHL* Output fall time (measured at 2.0V to 0.8V)
tJC
Cycle to Cycle Jitter (Unloaded Output)
tD
Output duty cycle
* tLH and tHL are measured into a capacitive load of 10pF
Min
VSS – 0.3
2
2.5
8
3.0
Min
10
10
20
40
0.5
0.8
45
ASM3P2811A/B
ASM3P2812A/B
ASM3P2814A/B
Min
Max
Unit
3.0
3.6
V
-40
+85
°C
10
pF
7
pF
Typ
Max
Unit
0.8
V
VDD + 0.3
V
-50
µA
50
µA
3
mA
3
mA
0.4
V
V
18
mA
4.5
mA
3.3
3.6
V
500
µS
76
Ω
Typ
0.9
1.0
±250
50
Max
40
40
80
160
1.2
1.3
55
Unit
MHz
MHz
MHz
MHz
nS
nS
pS
%
Low Power EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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