PE-68025T Datasheet, PDF (4/4 Pages) Pulse A Technitrol Company – SURFACE MOUNT 10BASE-T INTERFACE MODULES

SURFACE MOUNT 10BASE-T
INTERFACE MODULES
Fully Integrated for Adapter, Hub, and
Motherboard Applications
Schematic
E2009, PE-68056
CHIP SIDE
1
TRANSMIT CHANNEL
LOW PASS
FILTER
UTP SIDE
8
CHIP SIDE
16
RECEIVE CHANNEL
LOW PASS
FILTER
UTP SIDE
9
5
12
3
LOW PASS
FILTER
6
14
LOW PASS
FILTER
11
Turns Ratio for Transmit: PE-68056 is 1:1; E2009 is 1:1.414.
NOTE: The PE-68056 is designed for use with most transceivers requiring
a turns ratio of 1:1 on transmit. The E2009 is designed for use with DEC
and most other transceivers requiring a turns ratio of 1:1.414 on transmit.
Typical Applications Circuit
E2009, PE-68056
TXP-
TXD-
TXP+
TXD+
ANALOG INTERFACE MODULE
1
3
5678
LPF
LPF
LPF
LPF
2 _TD-
1 _TD+
3 _RD+
6 _RD-
RJ-45
CONNECTOR
RXI+
RXI-
16
100W
14 13 12 11 10 9
NOTE: Resistors NOT included in this module.
Application Notes
Each module in this application contains low pass filers, isolation
transformers, and common mode chokes. These components
provide impedance matching, equipment isolation, and EMI sup-
pression to comply with IEEE 802.3 requirements. The E2001,
E2003, E2007, PE-68025, and PE-68027 also provide the
necessary data and pre-emphasis resistors recommended by
most transceiver manufacturers.
User compliance with FCC/CSPR Class B requirements can be
achieved by applying rigorous design guidelines to suppress
noise mechanisms. Attention to high frequency signal paths,
UTP _{proper PCB grounding techniques, and component placement}
are critical. Pins 5 and 12, when grounded, provide noise return
paths. For PE-68025, PE-68026, and PE-68027, one of these
pins (typically pin 12) must be decoupled with a bypass
capacitor. The E2001, E2003, E2007, E2009, and PE-68056 do
not require the bypass capacitor, and pins 5 and 12 may be
connected directly to ground.
Recommended module orientation with respect to the RJ-45
connector is illustrated in each application circuit. Output pins
6 through 11 should be routed with short, matched traces to the
connector for optimum EMI performance.
Surface mount devices manufactured by Pulse are designed
to meet all published specifications after exposure to surface
mount soldering temperatures. The products in this data sheet
are transfer molded in IC-style packaging, making them robust
enough to withstand convection and infrared reflow solder
temperatures up to 235°C. In addition, compliant leads provide
excellent solder-joint reliability with a coplanarity of ±.002”
(0,05mm).
For Tape and Reel orders, please add the suffix "T" to the end of
the part number (i.e.PE-68025T).
For More Information:
Pulse Worldwide
Headquarters
12220 World Trade Dr.
San Diego, CA 92128
U.S.A.
www.pulseeng.com
Pulse European
Headquarters
Einsteinstrasse 1
71083 Herrenberg
Germany
TEL: [phone]
FAX: [phone]
TEL: [phone]
FAX: [phone]
Pulse China
Headquarters
B402 Shenzhen
Tech Innovation Internat’l
10th Kejinan Rd.
High-Tech Industrial Park
Nanshan District, Shenzhen
China
TEL: [phone]
FAX: [phone]
Pulse North China
Room 1503
XinYin Building
No. 888 YiShan Rd.
Shanghai 200233
China
Pulse South Asia
150 Kampong Ampat
#07-01/02
KA Centre
Singapore 368324
Pulse North Asia
No. 26
Kao Ching Rd.
Yang Mei Chen
Taoyuan Hsien
Taiwan, R. O. C.
TEL: [phone] TEL: [phone]
FAX: [phone] FAX: [phone]
TEL: [phone]
FAX: [phone]
Performance warranty of products offered on this data sheet is limited to the parameters specified. Data is subject to change without notice. Other brand and product names
mentioned herein may be trademarks or registered trademarks of their respective owners. © Copyright, 2007. Pulse Engineering, Inc. All rights reserved.
www.pulseeng.com
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