E2009QNLT Datasheet, PDF (4/4 Pages) Pulse A Technitrol Company – SURFACE MOUNT 10BASE-T INTERFACE MODULES

SURFACE MOUNT 10BASE-T
INTERFACE MODULES
Fully Integrated for Adapter, Hub, and
Motherboard Applications
Schematic
E2009QNL, PE-68056NL
CHIP SIDE
1
TRANSMIT CHANNEL
LOW PASS
FILTER
UTP SIDE
8
CHIP SIDE
16
5
3
LOW PASS
FILTER
6
14
RECEIVE CHANNEL
LOW PASS
FILTER
12
LOW PASS
FILTER
UTP SIDE
9
11
Turns Ratio for Transmit: PE-68056NL is 1:1; E2009QNL is 1:1.414.
NOTE: The PE-68056NL is designed for use with most transceivers requiring
a turns ratio of 1:1 on transmit. The E2009QNL is designed for use with DEC
and most other transceivers requiring a turns ratio of 1:1.414 on transmit.
Typical Applications Circuit
Application Notes
E2009QNL, PE-68056NL
Each module in this application contains low pass filers, isolation
transformers, and common mode chokes. These components provide
impedance matching, equipment isolation, and EMI suppression to
comply with IEEE 802.3 requirements. The E2001QNL, E2003QNL,
E2007QNL, PE-68025QNL and PE-68027QNL also provide the
necessary data and pre-emphasis resistors recommended by most
TXP-
ANALOG INTERFACE MODULE
transceiver manufacturers.
TXD-
TXP+
User compliance with FCC/CSPR Class B requirements can be
TXD+
achieved by applying rigorous design guidelines to suppress noise
1
3
5678
UTP mechanisms. Attention to high frequency signal paths, proper
2 _TD-
PCB grounding techniques, and component placement are critical.
LPF
LPF
1 _TD+
3 _RD+
Pins 5 and 12, when grounded, provide noise return paths. For
PE-68025QNL, PE-68026NL, and PE-68027QNL, one of these pins
(typically pin 12) must be decoupled with a bypass capacitor. The
LPF
LPF
6 _RD-
RJ-45
CONNECTOR
E2001QNL, E2003QNL, E2007QNL, E2009QNL, and PE-68056NL
do not require the bypass capacitor, and pins 5 and 12 may be
connected directly to ground.
Recommended module orientation with respect to the RJ-45
connector is illustrated in each application circuit. Output pins 6
through 11 should be routed with short, matched traces to the
RXI+
RXI-
16
100W
14 13 12 11 10 9
NOTE: Resistors NOT included in this module.
connector for optimum EMI performance.
Surface mount devices manufactured by Pulse are designed
to meet all published specifications after exposure to surface
mount soldering temperatures. The products in this data sheet are
transfer molded or open header in IC-style packaging, making them
robust enough to withstand convection and infrared reflow solder
temperatures up to 245°C. In addition, compliant leads provide
excellent solder-joint reliability with a coplanarity of ±.002” (0,05mm).
For More Information:
For Tape & Reel orders, please add the suffix “T” to the end of the
part number (i.e.PE-68025QNLT).
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Performance warranty of products offered on this data sheet is limited to the parameters specified. Data is subject to change without notice. Other brand and product
names mentioned herein may be trademarks or registered trademarks of their respective owners.
© Copyright, 2009. Pulse Engineering, Inc. All rights reserved.
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