PT6553_10 Datasheet, PDF (41/41 Pages) Princeton Technology Corp – LCD Driver IC with Key Input Function

LCD Driver IC with Key Input Function
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URL: http://www.princeton.com.tw
PT6553
Symbol Min. Typ. Max
A
-
-
1.60
A1
0.05
-
0.15
A2
1.35
1.40
1.45
b
0.17
0.22
0.27
D
12.00 BSC
D1
10.00 BSC
e
0.50 BSC
E
12.00 BSC
E1
10.00 BSC
ccc
0.08
θ
0°
3.5°
7°
θ
0°
-
-
θ2
11°
12°
13°
θ3
11°
12°
13°
c
0.09
-
0.20
L
0.45
0.60
0.75
L1
1.00 REF
R1
0.08
-
-
R2
0.08
-
0.20
S
0.20
-
-
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M-1994
2. The top package body size may be smaller than the bottom package size by as much as 0.15mm.
3. Datum A-B and D to be determined at the datum plane H.
4. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per
side. D1 and E1 are maximum plastic body size dimensions including mold mismatch.
5. Controlling Dimension: MILLIMETER
6. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not cause
the lead width to exceed the maximum b dimension by more than 0.08mm. Dambar cannot be
located on the lower radius or the foot. Minimum space between the protrusion and an adjacent
lead is 0.07mm for 0.4mm and 0.5mm PITCH package.
7. These dimensions apply to the flat section of the lead between 0.10mm and 0.25mm from the
lead tip.
8. A1 is defined as the distance from the seating plane to the lowest point on the package body.
9. Details of pin 1 identifier are optional but must be located within the zone identified.
10. Dimension D2 and E2 show the minimum allowed for the optional exposed heat slug. The
maximum allowed is equal to the package body size (D1 and E1). However, the size of the
exposed heat slug is variable depending on the device function (die size). End users should verify
the actual size or either top or bottom exposed thermal pad for specific device application.
11. Refer to JEDEC MS-026 Variation BCD.
JEDEC is the registered trademark of JEDEC SOLID STATE TECHNOLOGY ASSOCIATION.
PT6553 V1.7
- 41 -
November, 2007