PT8214 Datasheet, PDF (15/15 Pages) Princeton Technology Corp – 8-Bit D/A Converter IC

8-Bit D/A Converter IC
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URL: http://www.princeton.com.tw
PT8214
Symbol
A
A1
A2
b
D
D1
e
E
E1
θ
θ1
θ2
θ3
C
L
L1
R1
R2
S
ccc
Min.
Typ.
Max
-
-
1.60
0.05
-
0.15
1.35
1.40
1.45
0.17
0.22
0.27
9.00 BSC
7.00 BSC
0.50 BSC
9.00 BSC
7.00 BSC
0°
3.5°
7°
0°
-
-
11°
12°
13°
11°
12°
13°
0.09
-
0.20
0.45
0.60
0.75
1.00 REF.
0.08
-
-
0.08
-
0.20
0.20
-
-
0.08
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M-1994
2. The top package body size may be smaller than the bottom package size by as much as 0.15mm.
3. Datum A-B and D to be determined at the datum plane H.
4. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1 and E1
are maximum plastic body size dimensions including mold mismatch.
5. Controlling Dimension: MILLIMETER
6. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width
to exceed the maximum b dimension by more than 0.08mm. Dambar cannot be located on the lower radius or
the foot. Minimum space between the protrusion and an adjacent lead is 0.07mm for 0.4mm and 0.5mm
PITCH Package.
7. These dimensions apply to the flat section of the lead between 0.10mm and 0.25mm from the lead tip.
8. A1 is defined as the distance from the seating plane to the lowest point on the package body.
9. Details of pin 1 identifier are optional but must be located within the zone identified.
10. Dimension D2 and E2 show the minimum allowed for the optional exposed heat slug. The maximum allowed
is equal to the package body size (D1 and E1). However, the size of the exposed heat slug is variable
depending on the device function (die size). End users should verify the actual size or either top or bottom
exposed thermal pad for specific device application.
11. Refer to JEDEC MS-026 Variation BBC.
JEDEC is the registered trademark of JEDEC SOLID STATE TECHNOLOGY ASSOCIATION.
PT8214 V1.0
- 15 -
January, 2006