PE35400 Datasheet, PDF (11/13 Pages) Peregrine Semiconductor – UltraCMOS Divide-by-4 Prescaler, 3–13.5 GHz

PE35400
Divide-by-4 Prescaler
Die Mechanical Specifications
This section provides the die mechanical specifications for the PE35400.
Table 5 • Mechanical Specifications for PE35400
Parameter
Min
Typ
Max
Unit
Die size, singulated (x,y)
Wafer thickness
Wafer size
866 × 716
886 × 736
916 × 766
µm
180
200
220
µm
150
mm
Condition
Including excess sapphire, max
tolerance = –20/+30 µm
Table 6 • Pad Coordinates for PE35400^(*)
Pad Pad ^{Pad Center (µm)}
No. Name
X
Y
Pad Opening
Size (µm)
X
Y
1
V_BYPS
–303
198
160
180
2
V_BPYS
–303
–3
160
180
3
RF_IN
–303
–208
100
100
4
GND
68
–243
290
130
5
RF_OUT
333
–193
100
190
6
V_DD
318
40
130
190
7
R_BIAS
318
243
130
130
8
GND
14
243
290
130
Note: * All pad locations originate from the die center and refer to the
center of the pad.
Figure 13 • Pad Layout for PE35400⁽¹⁾⁽²⁾
1
V_BYPS
2
V_BYPS
8
GND
3
RF_IN
Die ID
4
GND
886 μm (−20 / +30 μm)
Notes:
1) Drawings are not drawn to scale.
2) Singulated die size shown, pad side up.
7
R_BIAS
6
V_DD
5
RF_OUT
DOC-64872-2 – (10/2015)
www.psemi.com
Page 11