ULC0404FC33C Datasheet, PDF (6/6 Pages) Protek Devices – UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

PACKAGE OUTLINE & DIMENSIONS
ULC0404FC3.3C
thru
ULC0404FC36C
MOUNTING PAD LAYOUT - Option 2
COPPER
CONTACTS
0.009” [0.23] DIA.
A
DIE
SOLDER
CONTACT
I
PACKAGE DIMENSIONS
DIM MILLIMETERS
A
0.51
F
0.15 SQ
G
0.71
H
0.99
I
0.51
INCHES
0.020
0.006 SQ
0.028
0.039
0.020
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
3. Preferred: Using 0.1mm (0.004”) stencil.
Outline & Dimensions: Rev 3 - 9/04, 06024
TAPE & REEL ORIENTATION
SOLDER PRINT
0.014” - [0.36] DIA.
SOLDER MASK
Laser
Orientation
Line
Dual Die - 0404
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and
reeled in accordance with EIA 481.
2. 8mm Plastic Tape: 7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-1
(i.e., ULC0404FC05C-T75-1).
3. 8mm Paper Tape: 7 Inch Reels - 10,000
pieces per reel. Ordering Suffix: -T710-2
(i.e., ULC0404FC05C-T710-2).
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or
specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: [phone] Fax: [phone]
E-Mail: [e-mail]
Web Site: www.protekdevices.com
05168.R5 4/05
6
www.protekdevices.com