U0406FC33C Datasheet, PDF (6/6 Pages) Protek Devices – UNBUMPED FLIP CHIP ARRAY

PACKAGE OUTLINE & DIMENSIONS
MOUNTING PAD LAYOUT - Option 2
COPPER CONTACTS
0.009” [0.23] DIA.
A
DIE
SOLDER
CONTACT
I
U0406FC3.3C
thru
U0406FC36C
PACKAGE DIMENSIONS
DIM MILLIMETERS
INCHES
A
0.51
F
0.15 SQ
G
0.71
H
0.99
I
0.51
0.020
0.006 SQ
0.028
0.039
0.020
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
3. Preferred: Using 0.1mm (0.004”) stencil.
Outline & Dimensions: Rev 2 - 11/02, 06025
TAPE & REEL ORIENTATION
SOLDER PRINT
0.014” [0.36] DIA.
SOLDER MASK
Triple Die - 0406
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and
reeled in accordance with EIA 481.
2. 8mm Plastic Tape: 7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-1
(i.e., U0406FC05C-T75-1).
3. 8mm Paper Tape: 7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-2
(i.e., U0406FC05C-T75-2).
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
05160.R3 3/05
6
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: [phone] Fax: [phone]
E-Mail: [e-mail]
Web Site: www.protekdevices.com
www.protekdevices.com