U0404FC33C Datasheet, PDF (5/6 Pages) Protek Devices – UNBUMPED FLIP CHIP ARRAY

PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
TOP
E
F
Metalized Die Contacts
END
I
MOUNTING PAD LAYOUT - Option 1
C
A
DIE
SOLDER
CONTACT
I
U0404FC3.3C
thru
U0404FC36C
PACKAGE DIMENSIONS
DIM MILLIMETERS
INCHES
A
0.56 NOM
0.022 NOM
B
0.86 NOM
0.034 NOM
C
1.0 ± 0.02
0.039 ± 0.001
E
0.15 SQ
0.006 SQ
F
1.0 ± 0.0254
0.039 ± 0.001
I
0.406 NOM
0.016 NOM
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
PAD DIMENSIONS
DIM MILLIMETERS
A
0.51
C
0.30
D
0.46
E
0.20
F
0.15 SQ
G
0.71
H
0.99
I
0.51
INCHES
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
NOTE:
1. Preferred: Using 0.1mm (0.004”) stencil.
SOLDER PRINT
0.010” - 0.012” DIA.
SOLDER PADS
SOLDER MASK
Outline & Dimensions: Rev 3 - 9/04, 06024
05159.R4 3/05
5
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