U0402FC33C Datasheet, PDF (5/5 Pages) Protek Devices – UNBUMPED FLIP CHIP ARRAY

PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
U0402FC3.3C
thru
U0402FC36C
U0402
TOP
D
E
F
Metalized Die Contacts
END
I
MOUNTING PAD
C
B
A
DIE
DIE
CONTACTS
I
PACKAGE DIMENSIONS
DIM
MILLIMETERS
INCHES
A
0.46 NOM
B
0.86 NOM
C
0.99 ± 0.0254
D
0.10 NOM
E
0.35 NOM
F
0.483 ± 0.0254
I
0.406 NOM
0.018 NOM
0.034 NOM
0.039 ± 0.001
0.004 NOM
0.014 NOM
0.019 ± 0.001
0.016 NOM
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and outline:
.xxx ± 0.05mm (± 0.002”).
3. Maximum chip size: 1.02 (0.040”) by 0.51(0.020”).
PAD DIMENSIONS
DIM
MILLIMETERS
INCHES
A
0.23
B
0.48
C
0.69
D
0.46
E
0.99
F
0.20
G
0.20
H
0.66
I
0.13
0.009
0.019
0.027
0.018
0.039
0.008
0.008
0.026
0.005
NOTE:
1. Top view of tape. Metal contacts are face down in tape
package.
TAPE & REEL ORIENTATION
SOLDER PRINT
DIAMETER 0.010” -
0.012”
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA 481.
2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., U0402FC05C-T75-1).
3. 8mm Paper Tape: 7 Inch Reels -10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., U0402FC05C-T710-2).
Single Die - 0402
NOTE:
1. Preferred: Using 0.1mm (0.004”) stencil.
Outline & Dimensions: Rev 3 - 11/02, 06020
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or
specifications of such products.
05149.R4 3/05
5
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: [phone] Fax: [phone]
E-Mail: [e-mail]
Web Site: www.protekdevices.com
www.protekdevices.com