PKFC33C Datasheet, PDF (4/5 Pages) Protek Devices – PACKAGED FLIP CHIP ARRAY

APPLICATION INFORMATION
PKFC3.3C*
thru
PKFC36C*
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
REQUIREMENTS
Temperature:
T_P for Lead-Free (SnAgCu): 260-270°C
T_P for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
T_P
T_L
T_SMAX
T_SMIN
05180.R3 12/05
Ramp-up
155°
Ramp-down
T_S - Preheat
140°
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
4
Solder Time Ramp-down
15-20 seconds
*PATENT PENDING
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