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P0201V05 Datasheet, PDF (4/7 Pages) Protek Devices – ultra low capacitance esd pr otection component
Only One Name Means ProTek’Tion™
solder reflow information
P0201V05
printed circuit board recommendations
parameter
value
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask Defined Pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.150mm
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
0.330mm Round
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance - Edge To Corner Ball
±50µm
Solder Ball Side Coplanarity
±20µm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Soldering Maximum Temperature
270°C
Requirements
Temperature:
TP for Lead-Free (Sn/Ag/Cu): 260-270°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux activa-
tion temperature, component size, weight, surface area and plating.
recommended non-solder mask
defined pad illustration
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
Maximum Solder Reflow
(35-53°C Above Maximum Solder Melt Temp)
TP
Solder Melt
Ramp-Up
(Maximum Temp)
Ramp-Down
05393.R0 11/12
Preheat
(Stay Below Flux Activation Temp)
30-60 seconds
Ramp-Up
15 seconds
(Minimize)
Solder-Time Ramp-Down
15-20 seconds
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