PMPS150_1812_15 Datasheet, PDF (3/6 Pages) Protek Devices – POLYMER PTC DEVICE

Only One Name Means ProTek’Tion™
typical device characteristics
Soldering parameters
Profile features pb-free assembly
Average Ramp-Up Rate -
Tsmin to Tp
3°C/Second Max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax)
150°C
200°C
60-180 Seconds
Time Maintained Above:
- Temperature (Tm)
- Time (tm)
217°C
60-150 Seconds
Peak Temperature (Tp)
260°C
Time within 5°C of Tp (tp) 20-40 Seconds
Ramp-Down Rate
6°C/Seconds Max
Time 25°C to Tp
8 Minutes Max
1. All temperatures refer to topside of the package, mea-
sured on the package body surface.
2. Recommended reflow methods: IR, Vapor Phase, Hot Air
Oven.
3. Devices are not designed to be wave soldered to the bot-
tom side of the board.
4. Devices can be cleaned using standard industry methods
and solvents.
5. If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
Tp
Tm
Tsmax
Tsmin
PMPS150-1812
Tp
Ramp-Up
Critical Zone
Tm to Tp
tm
ts Preheat
t 25°C to Peak
Time
Ramp-Down
notices
The devices are intended for protection against overcurrent or overtemperature fault conditions and should not be used when repeated fault conditions are antici-
pated. Operation beyond maximum ratings or improper use may result in device damage and possible arcing and flame.
WARNING
Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. Polymeric thermistors operate by
thermal expansion of the conductive polymer. If devices are placed under pressure or installed in space that would prevent thermal expansion, they may not properly
protect against fault conditions. Designs must be selected in such a manner that adequate space is maintained over the life of the product.
Twisting, bending, or placing the Polymeric thermistors in tension will decrease the ability of the device to protect against electrical faults. No residual force should
remain on the device after installation. Mechanical damage to Polymeric thermistors chip may affect device performance and should be avoided.
Chemical contamination of Polymeric thermistors should be avoided. Certain greases, solvents, hydraulic fluids, fuels, industrial cleaning agents, volatile components
of adhesives, silicones and electrolytes can have an adverse effect on the device performance.
Environmental conditions must not harm the thermistors. Use thermistors only in normal atmospheric conditions. Avoid use in deoxidizing gases, corrosive agents,
humid or salty conditions. Contact with any liquids and solvents should be prevented. Device performance can be impacted negatively if devices are handled in a
manner inconsistent with recommended electronic, thermal and mechanical procedures for electronic components.
05429.R0 7/13
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