K1-076_15 Datasheet, PDF (3/6 Pages) Protek Devices – HIGH POWERED TVS COMPONENT

Only One Name Means ProTek’Tion™
TYPICAL DEVICE CHARACTERISTICS
K SERIES
TABLE 1 - STANDARD PACKAGE , LEADED PROCESS, PACKAGE PEAK REFLOW TEMPERATURE
Package Thickness
Volume mm³ < 350
Volume mm³ >= 350
< 2.5mm
240 +0/-5°C
225 +0/-5°C
>= 2.5mm
225 +0/-5°C
225 +0/-5°C
NOTES:
1. The package thickness and volume dictates the maximum component temperature. The thermal gradients between packages can be reduced by using convection reflow processes.
2. Volume of the package does not account for the external terminals.
3. Package volume is the equivalent of package size multipled by the height.
Package Thickness
TABLE 2 - LEAD-FREE PROCESS, PACKAGE PEAK REFLOW TEMPERATURE
Volume mm³ < 350
Volume mm³ 250 - 2000
Volume mm³ > 2000
< 1.6mm
260 +0°C
260 +0°C
260 +0°C
1.6mm - 2.5mm
260 +0°C
250 +0°C
245 +0°C
>= 2.5mm
250 +0°C
245 +0°C
245 +0°C
NOTES:
1. The profiling tolerance is +0, -X °C but at no time will it exceed -5°C.
2. Volume of the package does not account for the external terminals.
3. The package thickness and volume dictates the maximum component temperature. The thermal gradients between packages can be reduced by using convection reflow processes.
4. Components used in lead-free assembly shall be evaluated using the lead-free classification temperature and profiles as defined in the above table.
5. Table 3 will help determine if the components are lead-free or not.
6. The device manufacturer/supplier shall ensure process compatibility up to and including the stated classification temperature at the rated MSL level.
Profile Feature
TABLE 3 - CLASSIFICATION REFLOW PROFILES
Sn - Pb Eutetectic Assembly
Pb-Free Assembly
Average Ramp Up Rate (T_SMAX to T_P)
Preheat
Temperature Min T_SMIN
Temperature MAX T_SMAX
Time (T_SMIN to T_SMAX) (ts)
Time Maintained Above
Temperature (T_L)
Time(t_L)
Peak/Classification Temperature (T_P)
Time Within 5°C of Actual Temperature (t_P)
Ramp-Down Rate
3°C/seconds Max.
100°C
150°C
60-120 seonds
183°C
60-150 seconds
See Table 1
10-30 seconds
6°C/seconds Max.
3°C/seconds Max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
See Table 2
20-40 seconds
6°C/seconds Max.
Time 25°C to Peak Temperature
6 Minutes Max.
8 Minutes Max.
NOTES:
1. All temperatures refer to topside of the package, measured on the package body surface.
2. Time within 5°C of the actual peak temperature (T_P) specified for the reflow profiles is “supplier” minimum and “user” maximum.
05459.R4 12/15
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