ULLC0408FC05C_12 Datasheet, PDF (1/8 Pages) Protek Devices – UNBUMPED LOW CAPACITANCE FLIP CHIP TVS ARRAY

Only One Name Means ProTek’Tion™
unbumped low capacitance flip chip tvs array
ULLC0408FC05C
Description
The ULLC0408FC05C Flip Chip employs advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Dis-
charge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 require-
ments. This low capacitance device is ideally suited for handheld devices, PCMCIA and SMART cards.
The ULLC0408FC05C provides ESD protection greater than 25 kilovolts and features superior clamping performance, low leakage current characteristics and a response
time of less than a nanosecond. The low inductance virtually eliminates overshoot voltage due to package inductance.
Features
• Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
• Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
• ESD Protection > 25 kilovolts
• Low ESD Overshoot Voltage
• Bidirectional Configuration & Monolithic Structure
• Protects 4 Isolated Lines
• Low Capacitance: 6pF
• Low Leakage Current
• RoHS Compliant
• REACH Compliant
Mechanical characteristics
• Standard EIA Chip Size: 0408
• Approximate Weight: 0.73 milligrams
• Lead-Free Plating
• Solder Reflow Temperature:
• Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
• Flammability Rating UL 94V-0
• 8mm Tape per EIA Standard 481
applications
• Cellular Phones
• Portable Electronics
• SMART Cards
PIN CONFIGURATION
05221.R3 10/12
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