ULL0402FC05C_12 Datasheet, PDF (1/7 Pages) Protek Devices – LOW CAPACITANCE UNBUMPED FLIP CHIP TVS ARRAY

Only One Name Means ProTek’Tion™
LOW CAPACITANCE unbumped flip chip tvs array
ULL0402FC05C
Description
The ULLC0402FC05C Flip Chip employs advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Dis-
charge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 require-
ments. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This low capacitance device provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In
addition, the ULLC0402FC05C features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low
inductance virtually eliminates overshoot voltage due to package inductance.
Features
• Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
• Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
• ESD Protection > 25 kilovolts
• Low ESD Overshoot Voltage
• Bidirectional and Monolithic Structure
• Protection for 1 Line
• Low Capacitance: 6pF
• Low Leakage Current
• RoHS Compliant
• REACH Compliant
Mechanical characteristics
• Standard EIA Chip Size: 0402
• Approximate Weight: 0.73 milligrams
• Lead-Free Plating
• Flammability Rating UL 94V-0
• 8mm Plastic Tape per EIA Standard 481
applications
• SMART Phones
• Portable Electronics
• SMART Cards
PIN CONFIGURATION
05192.R7 10/12
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