ULC0402FC3.3C_11 Datasheet, PDF (1/8 Pages) Protek Devices – 200W LOW CAPACITANCE unbumpe d flip chip tvs array

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200W LOW CAPACITANCE unbumped flip chip tvs array
ULC0402FC3.3C - ULC0402FC36C
Description
The ULC0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic
Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4
requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In
addition, the ULC0402FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their
low inductance virtually eliminates overshoot voltage due to package inductance.
Features
• Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
• Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
• ESD Protection > 25 kilovolts
• Available in Voltages Ranging from 3.3V to 36V
• 200 Watts Peak Pulse Power per Line (tp = 8/20µs)
• Bidirectional and Monolithic Structure
• Low Clamping Voltage
• Low Capacitance
• Protection for 1 Line
• RoHS Compliant
• REACH Compliant
Mechanical characteristics
• Standard EIA Chip Size: 0402
• Approximate Weight: 0.73 milligrams
• Lead-Free Plating
• Flammability Rating UL 94V-0
• 8mm Plastic Tape per EIA Standard 481
applications
• SMART Phones
• Portable Electronics
• SMART Cards
PIN CONFIGURATION
05152.R9 2/11
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