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LC0404FC3.3C_12 Datasheet, PDF (1/8 Pages) Protek Devices – 200W LOW CAPACITANCE FLIP CHIP TVS ARRAY | |||
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Only One Name Means ProTekâTionâ¢
200W LOW CAPACITANCE flip chip tvs array
LC0404FC3.3C - LC0404FC36C
Description
The LC0404FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Dis-
charge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 require-
ments. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In ad-
dition, the LC0404FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low
inductance virtually eliminates overshoot voltage due to package inductance.
Features
⢠Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
⢠Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
⢠ESD Protection > 25 kilovolts
⢠Available in Voltages Ranging from 3.3V to 36V
⢠200 Watts Peak Pulse Power per Line (tp = 8/20µs)
⢠Low Clamping Voltage
⢠Bidirectional Configuration & Monolithic Structure
⢠Low Capacitance
⢠Low Leakage Current
⢠Protection for 1 to 3 Lines
⢠RoHS Compliant
⢠REACH Compliant
Mechanical characteristics
⢠Standard EIA Chip Size: 0404
⢠Approximate Weight: 0.73 milligrams
⢠Lead-Free Plating
⢠Solder Reflow Temperature:
⢠Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
⢠Flammability Rating UL 94V-0
⢠8mm Tape per EIA Standard 481
⢠Top Contacts: Solder Bump 0.004â in Height (Nominal)
applications
⢠SMART Phones
⢠Portable Electronics
⢠SMART Cards
PIN CONFIGURATION
05157.R9 9/12
Page 1
www.protekdevices.com
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