LC0402FC3.3C_12 Datasheet, PDF (1/9 Pages) Protek Devices – 200W LOW CAPACITANCE FLIP CHIP TVS ARRAY

Only One Name Means ProTek’Tion™
200W LOW CAPACITANCE flip chip tvs array
LC0402FC3.3C - LC0402FC36C
Description
The LC0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Dis-
charge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 require-
ments. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In ad-
dition, the LC0402FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low
inductance virtually eliminates overshoot voltage due to package inductance.
Features
• Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
• Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
• ESD Protection > 25 kilovolts
• Available in Voltages Ranging from 3.3V to 36V
• 200 Watts Peak Pulse Power per Line (tp = 8/20µs)
• Bidirectional and Monolithic Structure
• Low Clamping Voltage
• Low Capacitance
• Low Leakage Current
• Protection for 1 Line
• RoHS Compliant
• REACH Compliant
Mechanical characteristics
• Standard EIA Chip Size: 0402
• Approximate Weight: 0.73 milligrams
• Lead-Free Plating
• Solder Reflow Temperature:
• Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
• Flammability Rating UL 94V-0
• 8mm Tape per EIA Standard 481
• Top Contacts: Solder Bump 0.004” in Height (Nominal)
applications
• SMART Phones
• Portable Electronics
• SMART Cards
PIN CONFIGURATION
05139.R10 912
Page 1
www.protekdevices.com