3DC11LP-AOI Datasheet, PDF (2/4 Pages) PREMO CORPORATION S.L – SMD 3D11 Coil Low Profile AOI 13x11.6x3.45 mm

3DCoil11LP-AOI-XXXXJ
3DCoil11LP-AOIF-XXXXJ (foam option)
3DCoil11LP-AOIC-XXXXJ (cap option)
SMD 3D11 Coil Low Profile AOI 13x11.6x3.45 mm
C/Severo Ochoa 33 – Parque Tecnológico de Andalucía. 29590 Campanillas. Málaga (Spain) Phone [phone] Fax [phone]
E-mail: [e-mail] Web http://www.grupopremo.com
2. Schematic Diagram
1
Wx
2-3
6-7
Wy
1
5
Wz
4
8
Designed for AMS ICs like AS3932 series, TI Chipset like MSP430 series, NXP, MAXIM (SensorDynamics), …etc
3. Materials
Core:
Ferrite Core
SMD Base: LCP with lead frame
Wires:
Enamell and Selfbonding copper wire
Label:
Polyimide with acrylic adhesive (*)
Pins:
Phosphor bronze with Sn100 finish
Foam Label: Acrylic foam with white polyimide and acrylic adhesive (*)
Cap:
LCP
Remark : Products comply with RoHS requirements.
(*)Label for flat top and ID marking. Not for autoplacement.
4. General Specifications. Recommended Reflow Profile
Typical Operating Frequency 125KHz
Storage Temperature -40 ºC → +85 ºC
Operating Temperature -40 ºC → +85 ºC
Lead Free Reflow Profile: _{Component temperature 250±5 ºC. Time 30 ± 5 s. Temperature}
Equivalent to test condition K from MIL- _{ramp/inmersion and emersion rate: 1ºC/s-4ºC/s. Time above 183}
STD-202G, method 210F ºC: 90-120 s.
2
Three Axes Transponder Inductors 3DCoil
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