PS320240T Datasheet, PDF (24/28 Pages) Powertip Technology – STANDARD VALUE

NO
Item
Specification
Judge Level
The shape of modeling is deformed by touching.
N.G. Major
Appearance of _{Insufficient epoxy: Circuit or pad of IC is visible}
N.G. Minor
6
molding
Excessive epoxy: Diameter of modeling is > 20mm
A=( L + W ) ÷2 _{or height is > 2.5mm}
N.G. Minor
The diameter of pinhole in modeling, A is > 0.2mm. N.G. Minor
The folding angle of frame must be > 45°+ 10°
N.G. Minor
7
Appearance of
frame
A=( L + W ) ÷2
The area of stripped electroplate in top-view of
frame, A is > 1.0mm.
Rust or crack is (Top view only)
The scratched width of frame is > 0.06mm.
(Top view only)
N.G. Minor
N.G. Minor
N.G. Minor
8
Electrical
characteristic of
backlight
The color of backlight is nonconforming
Backlight can’t work normally.
The LED lamp can’t work normally
The unsoldering area of pin for backlight,
A=( L + W ) ÷2 ^{A is > 1/2 solder joint area.}
The height of solder pin for backlight is > 2.0mm
N.G. Major
N.G. Major
N.G. Major
N.G. Minor
N.G. Minor
The mark or polarity of component is unidentifiable. N.G. Minor
The height between bottom of component and
surface of the PCB is floating > 0.7mm
N.G. Minor
D > 1/4W
W
D
N.G. Minor
10
Assembly parts
A=( L + W ) ÷2
D’
Pad
End solder joint width, D’ is > 50% width of
component termination or width of pad
Side overhang, D is > 25% width of component
termination.
Component is cracked, deformed, and burned, etc.
The polarity of component is placed in inverse
direction.
Maximum fillet height of solder extends onto the
component body or minimum fillet height
is < 0.5mm.
N.G. Minor
N.G. Minor
N.G. Minor
N.G. Minor
N.G. Minor
PH320240T-004-IC1Q Ver.0
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